◆Semiconductor Assembly Service
We will respond to the diverse needs of all customers, regardless of needs for prototype production or mass production, with the vast know-how of the semiconductor manufacturing process that we have cultivated over many years in the industry.
◆Information on Semiconductor Prototype Service
Custom Package Examples
Mass Production of Semiconductor Package
|We have a single pass through line all the way from electrical tests on wafers to package assembly/ measurement/ packaging and shipping. We can assure safe production with quality management. Also, by promoting manufacturing innovation activities in overseas countries, we obtain unbeatable performance in regards to cost.|
Detailed information can be seen by clicking on package classification and image.
Lead Frame Package：QFP/LQFP
Lead Frame Package：QFN
※We have a 2 types package thicknesses in our lineup:(A) 0.95±0.05mm(VQFN) and 0.75±0.05mm(WQFN)
We can correspond from IP design to assembly.
|Ball Pitch||Package Size|
We will accept orders starting from１pc.
We can produce other packages that are not in our lineup.
|Package type||Lead count||Body size||Lead pitch|
|Package type||Lead count||Body size(mm)||Lead pitch(mm)|
We will correspond to wire pull test, ball shear test, die shear test
◆We will accept orders from as little as 1 specimen.
◆It is possible to conduct tests with the customer present.
Please contact us for more details
|Test Name||Test Content||Compatible Standard|
|Wire Pull Test||Measures Tensile Strength of Bonding Wire.||SEMI-G73-0997 / MIL-STD-883 / IEC-60749-22 / JEITA-ED-4703|
|Ball Shear (Wire Bond Shear) Test||Measures Shear Strength of Wire and Pad.||ASTMF1269 / JESD22-B116 / MIL-STD-883 / IEC-60749-22 /|
JEITA-ED-4703 / AEC-Q100-010
|Die Shear Test||Measures Shear Strength of Die (Chip).||MIL-STD-883 / IEC-60749-19 / JEITA-ED-4703|
|Solder Ball L Shear Test||Measures Shear Strength of Solder Ball and Ball Pad.||MIL-STD-883 / JEITA-ED-4703|
Consistent inline support from loader to unloader inside a Class 100,00 clean room
◆Mounting line equipment list
|loader||NL1210TEH||Nagaoka Plant||Substrate loading device|
|Printer||SPG||Panasonic||Device for applying cream solder to a substrate with a squeegee|
|Mounter||AM100||Panasonic||Mounting device for surface mount components.|
|Intermediate conveyor||NZC-250E-600||Nagaoka Plant||Substrate transfer device|
|Reflow furnace||TNX25-537PH||Tamura Plant||Soldering equipment|
|Air cooled conveyor||NBC-250ER-1200||Nagaoka Plant||After reflow cooling device|
|Appearance inspection device||SI-V200||JUKI||Appearance inspection device for 2D camera|
|Unloader||NUS1210TEH||Nagaoka Plant||Substrate storage device|
◆Features of the mounting line ・We are capable of performing SMD mounting on devices, even when anti-dust measurements are required. ・We provide technology that combines the semiconductor assembly process & SMD mounting. ⇒The transcription unit is installed on the mounting device, making it possible for both flux transcription and adhesive transcription. When there is difficulty because of a narrow pitch, we have flip-chip mounting equipment that provides mounting options to satisfy specifications for product pitch, etc. By combining COB (bare chip mounting:wire bond + potting resin sealing), we achieve lighter, thinner, and smaller module products. 【Flip chip mounting + SMD mounting】 【COB (Chip on Board) Bare chip wire bonding + SMD mounting】 ・We consistently correspond with circuit board/tool design - semiconductor package assembly - SMD mounting. ・We possess analysis environments, which allow us to evaluate reliability and bonding conditions after mounting/assembly is completed.
Special Process Example
Please feel free to contact us about any matter regarding semiconductor assembly.