Semiconductor Assembly

           

◆Semiconductor Assembly Service

We will respond to the diverse needs of all customers, regardless of needs for prototype production or mass production, with the vast know-how of the semiconductor manufacturing process that we have cultivated over many years in the industry.

◆Information on Semiconductor Prototype Service

  •  We conduct about 500 assembly operations a year and have vast experience with a proven track record.
  •  We will assemble starting from 1 unit.
  •  We will respond immediately to urgent emergencies with a speed not available at other companies.
  •  Emergency Lead Time
    ・Ceramic type:Operation 1 day
    ・QNF type:Operation 3 days
    ・QFP type:Operation 3 days
  •  We are able to correspond to single process operations.(Design only, wire bonding only, etc.)
  •  We will correspond with flexibility to all customers' various needs.
  •  We will offer support with positive technical suggestions.

Service contents
Assembly Lineup
Strength Test
Mounting Technology
Assembly Technology
Custom Package Examples



Mass Production of Semiconductor Package

We have a single pass through line all the way from electrical tests on wafers to package assembly/ measurement/ packaging and shipping. We can assure safe production with quality management. Also, by promoting manufacturing innovation activities in overseas countries, we obtain unbeatable performance in regards to cost. 量産製造フロー

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Assembly Lineup

Detailed information can be seen by clicking on package classification and image.

  
パッケージサンプル1 パッケージサンプル2 パッケージサンプル3 パッケージサンプル4
QFP/LQFP QFN/SON LGA/BGA Ceramic・Package


Lead Frame Package:QFP/LQFP

パッケージサンプル
■ We will accept orders starting from1pc. ■


Package typeLead countBody size (mm)Lead pitch (mm)
QFP
10014×200.65
256□280.4
160□280.65
208□280.5
LQFP64□100.5
80□120.5
100□140.5
Lead Frame Package:QFN

パッケージ寸法裏面外観サンプル
 D  E  D1  E1  n 
  (lead count)  
e
  (lead pitch)  
2.51.01.21.02-
3.01.03.060.8
3.03.01.661.66160.5
1.81.8200.4
4.04.02.52.5240.5
5.05.03.153.15320.5
3.43.4400.4
6.06.04.44.4280.65
400.5
480.4
7.07.05.25.2480.5
8.08.06.56.5560.5
640.4
9.09.07.07.0640.5
7.47.4800.4
12.012.010.510.5840.5
1040.4

※We have a 2 types package thicknesses in our lineup:(A)  0.95±0.05mm(VQFN)  and  0.75±0.05mm(WQFN) 
We will launch other packages not in our lineup upon customer requests.


LGA/BGA package

パッケージサンプル
We can correspond from IP design to assembly.

Ball PitchPackage Size
□4□7□9□10□11□13□14□15□17□21□35□36□37.5
0.4mm104pin
0.5mm32pin273pin335pin385pin352pin
372pin
540pin
0.65mm81pin153pin
0.8mm144pin265pin
1.0mm336pin944pin953pin844pin


Ceramic・Package

パッケージサンプル
We will accept orders starting from1pc.
We can produce other packages that are not in our lineup.

  Package type    Lead count    Body size   Lead pitch  
QFP6414×201.0
8014×200.8
10014×200.65
120□280.8
12814×200.5
160□280.65
208□280.5
LQFP48□120.8
144□200.5
Package typeLead countBody size(mm)Lead pitch(mm)
PGA257□502.54
DIP14300mil2.54
16300mil2.54
20300mil2.54
24600mil2.54
28600mil2.54
42600mil2.54
SDIP48600mil1.778

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Strength Test

We will correspond to wire pull test, ball shear test, die shear test

◆We will accept orders from as little as 1 specimen.
◆It is possible to conduct tests with the customer present.

 Please contact us for more details

         
Test NameTest ContentCompatible Standard
Wire Pull Test Measures Tensile Strength of Bonding Wire. SEMI-G73-0997 / MIL-STD-883 / IEC-60749-22 / JEITA-ED-4703
Ball Shear (Wire Bond Shear) Test Measures Shear Strength of Wire and Pad. ASTMF1269 / JESD22-B116 / MIL-STD-883 / IEC-60749-22 /
JEITA-ED-4703 / AEC-Q100-010
Die Shear Test Measures Shear Strength of Die (Chip). MIL-STD-883 / IEC-60749-19 / JEITA-ED-4703
Solder Ball L Shear Test Measures Shear Strength of Solder Ball and Ball Pad. MIL-STD-883 / JEITA-ED-4703


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Mounting Technology


Consistent inline support from loader to unloader inside a Class 100,00 clean room


実装ライン設備

◆Mounting line equipment list

                                                                                                                                                        
設備型式メーカー用途
loader NL1210TEH Nagaoka PlantSubstrate loading device
PrinterSPGPanasonicDevice for applying cream solder to a substrate with a squeegee
MounterAM100PanasonicMounting device for surface mount components.
Intermediate conveyorNZC-250E-600Nagaoka PlantSubstrate transfer device
Reflow furnaceTNX25-537PHTamura PlantSoldering equipment
Air cooled conveyorNBC-250ER-1200Nagaoka PlantAfter reflow cooling device
Appearance inspection deviceSI-V200JUKIAppearance inspection device for 2D camera
UnloaderNUS1210TEHNagaoka PlantSubstrate storage device


◆Features of the mounting line
・We are capable of performing SMD mounting on devices, even when anti-dust measurements are required.

・We provide technology that combines the semiconductor assembly process & SMD mounting.
  ⇒The transcription unit is installed on the mounting device, making it possible for both flux transcription and adhesive transcription.
      When there is difficulty because of a narrow pitch, we have flip-chip mounting equipment that provides mounting options to satisfy specifications for product pitch, etc.
     By combining COB (bare chip mounting:wire bond + potting resin sealing), we achieve lighter, thinner, and smaller module products.
        フリップチップ実装+SMD実装          COB1 COB2 COB3
    【Flip chip mounting + SMD mounting】  【COB (Chip on Board) Bare chip wire bonding + SMD mounting】

・We consistently correspond with circuit board/tool design - semiconductor package assembly - SMD mounting.

・We possess analysis environments, which allow us to evaluate reliability and bonding conditions after mounting/assembly is completed.

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Assembly Technology

Assembly Technology
ItemsAssembly Result
Wafer DiameterΦ5,6,8,12inch
Wafer ThicknessMin. 50um
InterposerLead Frame Type、 Rigid/ Flexible Substrate,Ceramic PKG
Lead Frame Type
Terminal Surface Treatment
Sn-Pb plating
Sn-Bi(2wt%)plating
Palladium plating(PPF)
Chip SizeMin. □0.3mm~□20.0mm
Bonding Pad PitchMin. 40um
Bonding Pad OpeningMin. 30um
Items Assembly Result
Die Bond MaterialPaste (Conductivity Type, Insulated Type), Film
Joining MethodWire Bond, Flip Chip Bond, Thick Wire Bond
Wire MaterialAu、Al、Cu
Wire DiameterMin. Φ15um
Wire LengthMax. 8mm
Wire HeightMin. 50um
SealTransfer Mold, Potting (Liquid Resin)
Shipping FormTray, Reel, Etc.
Bonding Technology

Special Process Example



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Please feel free to contact us about any matter regarding semiconductor assembly.

お見積り・お問い合わせ

TEL:(0978)63-8856