Reliability

Reliability Evaluation Test Consignment

Each staff member is vastly experienced and will correspond to each customer's requests. Please do not hesitate to contact us with any matters regarding reliability evaluation test consignments.
We offer a wide range of services regarding semiconductor reliability evaluations.

◆We are able to correspond to AEC standards (D-CDM, FI-CDM).

The ESD-CDM test service is also compatible with the "AEC Q100-011" standard for automotive products.For more details, please click here.
Please contact us either by using the inquiry form or by telephone.


Reliability Evaluation Test Item List
■■<Test Item> <Corresponding Test Condition>
■■High Temperature Operating Life Test
(HTOL/OPE-LIFE)
Ambient Temperature +20℃~+200℃
■■High Temperature High Humidity Test
(THB/SOAK)
-20~+100℃ / 20~98%RH
■■High Temperature Storage Test
(BAKE)
Ambient Temperature +20℃~+250℃
■■Temperature Cycle Test (air to air)
(TEMP CYCLE)
High Temperature +60~+200℃ / Low Temperature 0~-70℃
■■Temperature Humidity Cycle Test
(TEMP HUMIDIT CYC)
150~-25℃/30~95%RH
■■Thermal Shock Test
(Thermal Shock)
High Temperature Tank:+70~+200℃ /Low Temperature Tank:-65~0℃
■■Saturated/ Unsaturated Vapor Pressure Test
(PCT/HAST)
105~160℃/75~100%RH
■■Solder Heat Resistance Test
(MS-LEVEL/Preparation/SAT)
JEDEC、JEITA
■■Solder Joint Evaluation Test JEDEC
■■ESD-HBM, MM Test
(ESD-HBM/MM)
JEDEC、JEITA
■■ESD-CDM Test
(ESD-CDM)
JEDEC、JEITA、AEC Q100-011
■■Electrostatic Discharge Test
(System Level ESD Test)
IEC61000-4-2/ISO10605 Standard Complaint
■■Joint Reliability Test
(Board Level Reliability)
Conduction Resistance Monitor
■■Latch-up Test JEDEC、JEITA
■■Mechanical Stress Test Vibration/Impact/Drop Test

We accept contracts for doing various experimental reliability evaluations. We also offer consultations on proposed testing based on the information provided to us by customers (products, applications, new material, etc.) After the evaluation, we will provide test results in the format requested by the customer.

In Order to Meet Customers' Requests:
□ Prepare the evaluation board required for the test, arrange the components/ jig.
□ Initial screening work with temperature stress test, etc.
□ Appearance screening work for abnormal items, etc.
□ Turnkey Service (correspondence test with multiple partner companies)
Our vastly experienced staff will correspond to each customer's requests.

Please feel free to contact us about any project or matter.
We offer high quality technology at a low price!

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『High Temperature Operating Life Test』HTB, HTOL, OPE-LIFE Test

Perform life test by operating the product under high temperatures.


◆Test Overview

The High Temperature Operating Life Test is performed by putting the product into operating conditions using a dedicated board and accelerating it with thermal stress/ high temperatures.
The test is conducted in order to confirm long-term defects, such as oxide film breakage, metal fatigue, and product life. In addition, by applying temperature acceleration along with voltage acceleration, it is possible to conduct a burn-in test for screening initial failures in a short period of time.

Reference Test Standard

・JEDEC (JESD22-A108) / JEITA(EIAJ ED-4701/101), etc.

Test Device

Name of Device Manufacturer Model Number Number of Units Capacity Tank Size (WxDxH)
Incubator ESPEC PH-202(M) 1 Room Temperature +20~200℃ 600x600x600mm
Incubator ESPEC PHH-200 1 Room Temperature +20~300℃ 600x600x600mm
Incubator ESPEC PH-100 2 Room Temperature +30~200℃ 450x450x450mm

Picture of Device
PH-202(M)
恒温槽A
PHH-200
恒温槽B

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『High Temperature/ High Humidity Test ・High Temperature/ High Humidity Bias Test』THB, SOAK Test

Perform reliability test to check product resistance under high temperature and high humidity environments. It is also possible to perform high temperature/ high humidity bias tests by creating a test board and checking electrical continuity.


◆Test Overview

Perform high temperature/ high humidity test to check the product's resistance under high temperature and high humidity environments. In the high temperature/ high humidity bias test, voltage is applied to a test board under high temperature and high humidity environment. Afterward, the resistance of the product, such as insulation and migration, is evaluated.
Most semiconductor devices are molded in resin. The reliability of this resin is largely dependent on its moisture resistance, which is the main purpose of this evaluation.

Reference Test Standard

・JEDEC (JESD22-A101) / JEITA(EIAJ ED-4701/121)etc.

Test Device

Name of Device Manufacturer Model Number Number of Units Capacity Tank Size(WxDxH)
Small Environment Testing Chamber ESPEC SH-221 2 25~150℃
30~95%RH
290x210x290mm
Small Environment Testing Chamber ESPEC SH-641 1 -40~150℃
30~95%RH
400x400x840mm
Small Environment Testing Chamber ESPEC SH-662 2 -60~150℃
30~95%RH
400x400x400mm
Temperature and Humidity Chamber ESPEC PR-3J 1 -20~100℃
20~98%RH
600x800x850mm
Temperature and Humidity Chamber ESPEC PH-3KT-E 1 (室温+10)~100℃
40~98%RH
600x800x850mm
Low Temperature Constant Temperature/ Humidity Testing Chamber ESPEC PH-3KP-E 2 -40~100℃
20~98%RH
600x800x850mm
Low Temperature Constant Temperature/ Humidity Testing Chamber ESPEC PL-4J 1 -40~100℃
20~98%RH
1000x800x1000mm
Temperature and Humidity Testing Chamber
(Corresponds to extremely low temperatures)
ESPEC PSL-4J 1 -70~100℃
20~98%RH
1000x800x1000mm

Picture of Device
 

Small Environment Testing Chamber SH-221
小型環境試験器
Temperature and Humidity Chamber PR-3J
高温高湿器A
Temperature and Humidity Chamber PH-3KT
高温高湿器B


Small Environment Testing Chamber SH-641
小型環境試験器

Small Environment Testing Chamber SH-662
小型環境試験器
Low Temperature Constant Temperature/ Humidity Testing Chamber PL-4J
低温恒温恒湿器
Extremely Low Constant Temperature and Humidity Testing Chamber PSL-4J
超低温恒温恒湿器

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High (Low) Temperature Storage Test

We conduct reliability tests to check the product's resistance under a high temperature environment. We will also perform a low temperature storage test upon request.


◆Test Overview

In the high-temperature storage test (HTB test), tests are conducted to check the reliability and durability of a product when stored for long periods at high temperatures.
There are some assumed defects, such as metal fatigue, that affect product life. This test is also used as a method to check written data corruption of the EEPROM.

Reference Test Standard

・JEDEC (JESD22-A103) / JEITA(EIAJ ED-4701/201)etc.

Test Device

Name of Device Manufacturer Model Number Number of Units Capacity Tank Size (WxDxH)
Small High Temperature Chamber ESPEC ST-120 1 20~200℃ 350x370x270mm
Small High Temperature Chamber ESPEC STH-120 2 20~300℃ 360x330x240mm
Extremely Low Temperature Storage ESPEC BVF-130 1 -20~-80℃ 490x600x1035mm
Picture of Device
Small High Temperature Chamber ST-120
ST-120
Small High Temperature Chamber PH-100
PH-100
Extremely Low Temperature Storage BFV-130
BFV-130
Small High Temperature Chamber STH120

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Temperature Cycle Test (air to air)

We conduct a test to check a product's resistance under an environment with repeating high to low temperatures. Temperature Cycle Test (TC, TC screening), Thermal Shock Test (Thermal Cycle).
he temperature profile will be adjusted as requested.


◆Test Overview

In the temperature cycle reliability test (TEMPCYCLE), temperature stress is applied to an electronic part by repeatedly alternating between high and low temperatures, causing failure to occur in a short amount of time compared to actual use environments (TC Screening).
Some examples of failures are Package cracks, shorts from wire breakage, and peeling defects within package.

Reference Test Standard

・JEDEC (JESD22-A104) / JEITA(EIAJ ED-4701/105)など。

Test Device
Name of Device Manufacturer Model Number Number of Units Capacity Tank Size (WxDxH)
Thermal Shock Chamber
ESPEC
TSA-71S-W 1 -70~0℃
+60~+200℃
410x370x460mm
TSA-73ES-W 1 -70~0℃
+60~+200℃
410x370x460mm
TSA-101S-W 3 -70~0℃
+60~+200℃
650x370x460mm
TSA-201S-W 3 -70~0℃
+60~+200℃
650x670x460mm
TSA-203ES-W 3 -70~0℃
+60~+200℃
650x670x460mm
Heat Shock Testing Chamber HITACHI ES-106L 1 -65~0℃
+60~+200℃
550x530x450mm
Picture of Device

TSA-201S-W
冷熱衝撃装置A
ES-106L
冷熱衝撃装置B
TSA-203ES-W
冷熱衝撃装置C

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Temperature and Humidity Cycle Test

Constant Temperature and Humidity Test, Temperature and Humidity Cycle Test. We will create a program in the sequence of your choice under a high to low temperature environment and conduct a reliability test to check for product tolerance.


◆Test Overview

Temperature and Humidity Cycle Test is a semiconductor reliability environmental test conducted to check the failures that occur to the product by repeating the high temperature, low temperature, high humidity, low humidity cycle.

Reference Test Standard

・JEDEC (JESD22-A100)/ JEITA(EIAJ ED-4701/203)/ JIS C 0028-1988 ,etc.

Test Device
Name of Device Manufacturer Model Number Number of Units Capacity Tank Size(WxDxH)
Small Environmental Testing Chamber ESPEC SH-221 2 150~-25℃
30~95%RH
290x210x290mm
Small Environmental Testing Chamber ESPEC SH-641 1 -40~150℃
30~95%RH
400x400x840mm
Small Environmental Testing Chamber ESPEC SH-662 2 -60~150℃
30~95%RH
400x400x400mm
Picture of Device
Small Environmental Testing Chamber SH-221
小型環境試験器
Small Environmental Testing Chamber SH-641
小型環境試験器
Small Environmental Testing Chamber SH-662
小型環境試験器

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Thermal Shock Test (liquid to liquid )

A test performed to check the resistance when exposed to rapid temperature change.


◆Test Overview

Test results can be obtained in a short period of time, compared to temperature cycle testing (air to air), due to rapid high thermal stress. In some cases, there is a possibility of failure mode occurring that would never happen in the market.

Reference Test Standard

・JEDEC(JESD22-A106) /JEITA(EIAJ ED-4701/307),etc.

Test Device
Name of Device Manufacturer Model Number Number of Units Capacity Specimen Basket Size(WxDxH)
Liquid to Liquid Thermal Shock Chamber ESPEC TSB-51 2 High Temperature Tank:+70~+200℃
ow Temperature Tank:-65~0℃
150x200x150mm

※sing Galden.

Picture of Device
Liquid to Liquid Thermal Shock Test TSB-51
液槽冷熱衝撃試験

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『Saturated /Unsaturated Vapor Pressure Test』PCT、HAST

PCT (Pressure Cooker Test) is performed to absorb excessive moisture with high temperature, high humidity, and vapor pressure to check the product's tolerance.
HAST (Highly Accelerated Temperature and Humidity Stress Test) is also possible by creating a test board to check electrical continuity.


◆Test Overview

The Saturated/ Unsaturated Vapor Pressure Test isa reliability test that performs moisture infiltration to an electrical product in a short period of time by applying vapor pressure in an environment with a temperature over 100℃. (Highly Accelerated Temperature and Humidity Stress Test)The Saturated/ Unsaturated Vapor Pressure Test isa reliability test that performs moisture infiltration to an electrical product in a short period of time by applying vapor pressure in an environment with a temperature over 100℃. (Highly Accelerated Temperature and Humidity Stress Test)
he main evaluated contents of this test include aluminum wiring corrosion, migration, short failure due to moisture intrusion, etc.

Reference Test Standard

・JEDEC (JESD22-A110B)(JESD22-A118)(JESD22-A102C),etc.

Test Device
Name of Device Manufacturer Model Number Number of Units Capacity Tank Size(WxDxH)
Highly Accelerated Stress Test Chamber HIRAYAMA PC422 R3 1 105~162.5℃
65~100%RH
260x410x230mm
Highly Accelerated Stress Test Chamber ESPEC TPC-411D 1 105~162.2℃
75~100℃
29.5φx300mm
Highly Accelerated Stress Test Chamber ESPEC EHS-221MD 1 105.0~142.9℃
75~100%rh
29.5φx300mm
Highly Accelerated Stress Test Chamber ESPEC EHS-221M 1 105~142.9℃
75~100℃
29.5φx300mm

Picture of Device

PC422 R3
PC422 R3
TPC-411D
TPC-411D
EHS-221MD
EHS-221MD
EHS-221M

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『Solder Heat Resistance Test』MS-Level, Precon Test

◆Test Overview

We conduct the Solder Heat Resistance Test as prescribed by the major standard "BAKE~SOAK~REFLOW" for pretreatment of products before executing each environmental test.
This allows us to conduct preliminary confirmation of moisture absorption levels, package cracking, internal peeling, etc. by using the reflection method and transmission method of ultrasonic exploration imaging equipment (SAT) before and after the test.

耐熱試験

Reference Test Standard

・JEDEC (JESD22-A113)(J-STD-020)etc.

Test Device
Name of Device Manufacturer Model Number Number of Units Capacity
Reflow TAMURA TNR15-225LH 1 -
Scanning Acoustic Tomograph(SAT) HITACHI mi-Scope Hyper 1 Reflection Method:25MHz・50MHz
Transmission Method:25MHz

Picture of Device

Reflow TNR15-225LH
(株)デンケン
Scanning Acoustic Tomograph(SAT) mi-Scope Hyper
(株)デンケン

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Solder Bond Evaluation Test

This test is performed to confirm the resistance when exposed to rapid temperature change.


◆Test Overview

Specimen Temperature 15℃/Minute Temperature Gradient of JEDEC Standard is available.

Reference Test Standard

・JESD22-A104B / IEC-61747-5(EIAJ ED-2531A)etc.

Test Device
 
Name of Device Manufacturer Model Number Number of Units Temperature Range Tank Size(WxDxH)
Rapid Temperature Change
Chamber
ESPEC TCC-150W 2 -70~180℃800x400x500mm

※Using Galden.

Picture of Device

Rapid Temperature Change Chamber TCC-150W

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『ESD-HBM/MM Test』
Electrostatic Discharge Sensitivity Testing

ESD testing can be performed for up to 256 pins HBM (± 8 KV) MM (± 4 KV).


◆Test Overview

Electrostatic Discharge Destruction Test/ ESD test (Electrostatic Discharge Sensitivity Testing) is a reliability test aimed at confirming the electrostatic breakdown tolerance of semiconductors.

・Human Body Model (HBM method)
Test assuming model will discharge when human body contacts the semiconductor

・Machine Model (MM method)
Test assuming model will discharge when metal objects contact the semiconductor

Reference Standard

・JEDEC (JESD22-A114F) / EIAJ (ED-4701-304)

Test Device
Name of Device Manufacturer Model Number Number of Units Capacity
ESD Tester Hanwa Electronic Industry Co.,Ltd. HED-S5256M 1 Maximum Applied Voltage±4000V
ESD Tester Hanwa Electronic Industry Co.,Ltd. HED-S5256A 1 Maximum Applied Voltage±8000V
Picture of Device

ESD Tester HED-S5256A
ESDテスター

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『ESD-CDM Test』Charged Device Model

EDS-CDM testing can be performed for up to 1024 pins with ± 4000 V.

The ESD-CDM test recently became correspondent with the "AEC Standard (D-CDM, FI-CDM)".

The ESD-CDM test service also corresponds to the "AEC Q100-011" standard for automotive products.


◆Test Overview

The ESD-CDM (Charged Device Model) test is a reliability test assuming the model will be discharged when the electrode of an electronic part positively charged with static electricity contacts an external conductor.

Reference Test Standard

・JEDEC (JESD22-C103) / JEITA (EIAJ ED-4701/305)
※Standard for On-Vehicle Product「AEC Q100-011」(D-CDM,FI-CDM)

Test Device
Name of Device Manufacturer Model Number Number of Units Capacity
CDM Tester Hanwa Electronic Industry Co.,Ltd. HED-C5002 1 Maximum Applied Voltage ±4000V
Picture of Device

CDM Tester HED-C5000
CDMテスター

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『Electrostatic Test』System Level ESD Test


◆Test Overview

We are able to conduct tests that check the resistance to static electricity of the module board or other product components.

Reference Test Standard

IEC61000-4-2 / ISO10605, etc.

Test Device
Name of Device Manufacturer Model Number Number of Units Capacity
Electrostatic Testing Device
ESS Series
Noise Laboratory Co., Ltd. ESS-S3011 1 0.20kV~30.0kV、150pF-330Ω、330pF-330Ω330pF-2kΩ、150pF-2kΩ、500pF-0Ω
Picture of Device

Electrostatic Testing Device ESS Series

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『Bonding Reliability Test』Board Level Reliability

It is possible to test the solder bonding strength by using a conduction resistance monitoring device, in combination with temperature cycle and vibration/ impact tests.


◆Test Overview

The Bonding Reliability test confirms the solder bonding strength of the PKG mounted on a board using a conduction resistance monitor measuring device in combination with temperature cycle and vibration/ impact tests, etc.

Reference Test Standard

・JEDEC / JEITA ,etc

Test Device
Name of Device Manufacturer Model Number Number of Units Capacity
O/S Tester DENKEN DKOST-1000PT 1 Maximum256ch

Picture of Device
DKOST-1000PT
DKOST-1000PT
Monitor Screen
モニター画面

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『Latch-up Test』Latch-up Test


◆Test Overview

It is possible for us to conduct Latch-up tests, such as the Pulse Current Injection Method or Power Supply Overvoltage Method.

Reference Test Standard

・JEDEC / JEITA,etc

Test Device
Name of Device Manufacturer Model Number Number of Units Capacity
Reference Test Standard Hanwa Electronic Industry Co.,Ltd. HLT-1024LT 1 1024pin、6power Max60V
(power 1~256pin、I/O 257~1024pin)

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For more details, please contact us using the inquiry form or by telephone.


TEL:(0978)63-8856