DENKEN

ELECTRONICS

Line up

Lead frame package (QFP/LQFP)

Package typeLead countBody size(mm)Lead pitch
QFP8014×140.65
10020×140.65
16028×280.65
LQFP6410×100.5
8012×120.5
10014×140.5

Lead frame package (QFN)

Package typeLead countBody size(mm)Lead pitchExposed pad size
QFN163×30.51.66×1.66
203×30.41.80×1.80
244×40.52.50×2.50
286×60.654.40×4.40
325×50.4/0.53.15×3.15
405×50.43.40×3.40
6×60.54.40×4.40
486×60.44.40×4.40
7×70.55.20×5.20
527×70.45.20×5.20
568×80.56.50×6.50
648×80.46.50×6.50
9×90.57.00×7.00
809×90.47.40×7.40
8412×120.510.5×10.5

※We have two kinds of package thickness as our line up that are 0.95±0.05mm(VQFN) and 0.75±0.05mm(WQFN).
※A custom frame is possible in terms of QFN type. Please ask us if package type other than line up ones are necessary.

LGA/BGA package

It is possible from IP design to assembly.
Package development is available upon requested package specifications.

Ceramic package

Procurement other than line up ones are possible.

Package typeLead countBody size(mm)Lead pitch
QFP4812×120.8
6420.12×12.020.8/1.0
8020×140.8
12828×280.8
16028×280.65
20827.2×27.20.5
25627.2×27.20.4
LQFP10020.6×14.50.65
12028×280.5
14420×200.5
PGA25744.5×44.52.54
DIP1620.32×7.872.54
2025.4×7.872.54
2430.48×15.52.54
SDIP3027.4×10.411.78
4238×15.491.778
4843.18×15.491.778
page top