Module technology is the one to integrate multiple small parts and LSIs into a package. This is quite effective way for realizing miniaturization and high functionality of semi-conductor parts. Further miniaturization and high functionality can be possible by combining flip chip method.

Flip chip method

Conventional C4 method

• Open failures tend to occur from thermal deformation of PCBs and chips when reflowing
  Open failures tend to occur from thermal deformation of PCBs and chips when reflowing

Local C4 method

• Realize high position accuracy owing to the method of chip pressuring and maintaining heating and cooling to finish soldering with no self aliment. Thin chip and narrow pitch can be possible.
• It is possible to cure by keeping bump shape to secure requested gap with precious head control such as head thermal expansion correction.

Module packaging example