ELECTRONICS
AEC
AEC-Q100 TEST GROUP A Environment Stress Test
| Test items | Reference standard |
|---|---|
| Preconditioning (PC) | JESD22 A113 J-STD-020 |
| High Temperature Humidity Bias test (THB) High Accelerated Stress Test (HAST) | JESD22 A101 JESD22 A110 |
| Autoclave (AC)/PCT Unbiased Highly Accelerated Stress Test (uHAST) | JESD22 A102 or JESD22 A118 |
| Temperature Cycling test (TC) | JESD22 A104 |
| Power Temperature Cycling test (PTC) | JESD22 A105 |
| Intermittent Operating Life test (IOL) Power Cycling test | MIL-STD-750 1037 |
| High Temperature Storage test (HTSL) | JESD22 A103 |
AEC-Q100 TEST GROUP B Accelerated Stress Test
| Test items | Reference standard |
|---|---|
| High Temperature Operating Life (HTOL) | JESD22 A108 |
| Early Life Failure Rate (ELFR) | AEC-Q100-0008 |
AEC-Q100 TEST GROUP C Package Assembly Preservation Test
| Test items | Reference standard |
|---|---|
| Wire bonding share strength | AEC-Q100-001 |
| Wire bonding pull strength | MIL-STD-883 Method2011 |
| Solder wettability | JESD22 B102 |
| Device external dimension check | JESD22 B100 JESD22 B108 |
| Solder bonding share strength | AEC-Q100-010 |
| Terminal strength | JESD22 B105 |
AEC-Q100 TEST GROUP E Electrical Characteristics Confirmation
| Test items | Reference standard |
|---|---|
| Electrical test | User/Supplier Specification |
| ESD HBM（Human Body Model) | AEC-Q100-002/JS-001 |
| ESD CDM (Charged Device Model) | AEC-Q100-011/JS-002 |
| Latch up | AEC-Q100-004 |
| Electrical characteristics evaluation | AEC-Q100-009 |
| Pb free evaluation | AEC-Q005 |
AEC-Q100 TEST GROUP F Cavity Package Test (ceramic package)
| Test items | Reference standard | |
|---|---|---|
| Mechanical shock test | JESD22 B104 | ※Outsourcing |
| Vibration test | JESD22 B103 | ※Outsourcing |
| Constant acceleration test | MIL-STD-883 Method 2001 | ※Outsourcing |
| Drop test | - | ※Outsourcing |
| Drop test | AEC-Q100-009 | ※Outsourcing |
| Die share test | MIL-STD-883 Method 2019 |
