ELECTRONICS
JEDEC
JESD47 Device qualification tests
| Test items | Reference standard |
|---|---|
| High Temperature Operating Life (HTOL) | JESD22 A108 JESD85 |
| Early Life Failure Rate (ELFR) | JESD22 A108 JESD74 |
| Low Temperature Storage test (LTOL) | JESD22 A108 |
| High Temperature Storage test(HTSL) | JESD22 A103 |
| Latch up | JESD78 |
| High Temperature Storage test | JESD22 A103 |
| ESD HBM（Human Body Model) | JS-001 |
| ESD CDM (Charged Device Model) | JS-002 |
JESD47 Qualification tests for components in nonhermetic packages
| Test items | Reference standard |
|---|---|
| Preconditioning SMD only Moisture Preconditioning | JESD22 A113 |
| High Temperature Storage test(HTSL) | JESD22 A103&A113 |
| High Temperature Storage test(THB) | JESD22 A101 |
| High Temperature Humidity Bias High Accelerated Stress Test (HAST) | JESD22 A110 |
| Temperature Cycling test (TC) | JESD22 A104 |
| Unbiased Highly Accelerated Stress Test (uHAST) | JESD22 A118 |
| Autoclave (AC) | JESD22 A102 |
| Solder Ball Share (SBS) | JESD22 B117 |
| Bond Pull Test (BPS) | M2011 |
| Ball Share (BS) | JESD22 B116 |
| Solder wettability test | M2003 J-STD-002 |
| Sn whisker test | JESD22 A121 |
JESD47 Qualification test for components in hermetic packages
| Test items | Reference standard |
|---|---|
| Temperature Cycling test (TC) | JESD22 A104 |
| Bond Pull Test (BPS) | M2011 |
| Ball Share (BS) | JESD22 B116 |
| Solder wettability test | M2003 J-STD-002 |
| Solder Ball Share (SBS) | JESD22 B117 |
| Mechanical shock test | JESD22 B104 |
| Vibration test | JESD22 B103 |
| Constant acceleration test | MIL-STD-883 Method 2001 |
| Appearance | Customers specifications |
| External dimensions | Customers specifications |
| Sn whisker test | JESD22 A121 |
