We can offer various kind of FIB service such as circuit correction, defect investigation at circuit design, effect confirmation at mask change and fine image confirmation/cross-section observation with second electron, realizing quick TAT, integrated service (decap～FIB～analysis) , higher skill and technology.

Available for wide range of samples such as PKG products, wafer(up to 12-inch), PCB, bear chip etc.

• Al, Cu(Low-K) wiring process (minimum : 40nm)
• Integrated multiple processes from decap, pre-processing of removal polyimide, up to resin sealing after processing.
• Accurate locational processing by using GDS data overlay system
• PAD make for probes and probe/needle contact are available.
• The FIB place is completely private room and therefore customers can be there to see what are going on.

※GDS data submission may be required.