Analysis
We support semi-conductor products failure analysis with wide range of methods regardless of non-destructive or destructive analysis. Our high educated and experienced engineers can meet various kinds of customers' requirements.
Service line-up
cross-section FIB analysis
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STEM analysis
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FIB circuit change
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cross-section/
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Decap/peeling off analysis
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Electrical characteristic test
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OBIRCH・EMISSION analysis
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Non-destructive analysis (X-ray/SAT)
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